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Sensor Plate inspection equipment
It is a device that UV-bonds the CMOS effective surface and the metal plate reference surface mounted on the Sensor PCB in parallel with XYΘ. The purpose is to prevent the occurrence of left and right Focus deviation due to the CMOS effective surface Til
Specification
- Main structures : PCB Stage (XYZ 3-axis), Plate Stage (Tilt, Θ 3-axis), Camera Stage & Bonding/Hardening (XYZ 3-axis + Diagonal Cylinder 1-axis)
- Bonding precision: X/Y - 25 μm, Sensor Tilt: within 2.5'
- Tact Time: Within 2 minutes
- Bonding precision: X/Y - 25 μm, Sensor Tilt: within 2.5'
- Tact Time: Within 2 minutes
Machine Features
- Manual loading/unloading method
- 2x/10x Microscope Lens Automatic Change
- High precision stage application
- Pre-bonding inspection and post-bonding inspection (compare data before and after bonding)
- Defective separately discharged
- Multiple iterations of Align function for increased precision
- Simple configuration, considering worker convenience
- 2x/10x Microscope Lens Automatic Change
- High precision stage application
- Pre-bonding inspection and post-bonding inspection (compare data before and after bonding)
- Defective separately discharged
- Multiple iterations of Align function for increased precision
- Simple configuration, considering worker convenience
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