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Machine Vision Equipment
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Semiconductor
Semiconductor wafer inspection system
Semiconductor wafer inspection system
It is able to inspect automatically scratch, foreign material, broken of semiconductor wafer processing via machine vision system.
Specification
- Target : 6” wafer
- Inspection Item : Scratch, broken, Foreign material
- Inspection Speed : 15Min/1wafer
- Camera : 14M Pixel 1EA
- Lens : Telecentric Lens 1EA
- Motion Control : X, Y, θ axies control
- Target Loading / Unloading : Manual Loading/Unloading
- Inspection Item : Scratch, broken, Foreign material
- Inspection Speed : 15Min/1wafer
- Camera : 14M Pixel 1EA
- Lens : Telecentric Lens 1EA
- Motion Control : X, Y, θ axies control
- Target Loading / Unloading : Manual Loading/Unloading
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